Product Description

Product Information

  • Product Name: Dahua 512GB NVMe M.2 PCIe SSD
  • Model Series: Various (DH-XXX series, specific model varies by production batch)
  • Brand: Dahua Technology Co., Ltd.
  • Category: NVMe Solid State Drive
  • Release Year: 2020-2022 (various production periods)
  • Form Factor: M.2 2280 (M-key, PCIe interface only, not SATA compatible)
  • Dimensions: 22mm width × 80mm length × 2.2mm thickness (single-sided design)
  • Weight: Approximately 8-12 grams
  • PCB Color: Green with black/white information label

Performance Specifications

  • Sequential Performance (Maximum):
    • Read: Up to 2,400 MB/s
    • Write: Up to 1,800 MB/s
  • Sequential Performance (Sustained):
    • Read: 1,800-2,200 MB/s (typical real-world performance)
    • Write: 1,200-1,600 MB/s (after SLC cache exhaustion)
  • Random Performance (4KB):
    • Random Read: 150,000-180,000 IOPS (QD32)
    • Random Write: 180,000-200,000 IOPS (QD32)
  • Access Time: <0.1ms (typical NVMe SSD latency)
  • Queue Depth: Supports up to 64K commands
  • SLC Cache Size: Dynamic allocation, approximately 40-80GB depending on drive usage and free space
  • Cache Performance: Write speeds maintained at maximum within cache, then reduced to native TLC speeds

Controller & Architecture

  • Controller Model: Realtek RTS5763DL or Maxio MAP1202 (or similar entry-to-mid-range NVMe controller)
  • Controller Type: 4-channel NVMe controller optimized for TLC NAND
  • Processor: 32-bit/64-bit RISC-based processor
  • Host Interface: PCIe 3.0 x4 to NVMe bridge with advanced power management
  • Error Correction: LDPC (Low-Density Parity Check) ECC engine with strong error correction capability
  • Wear Leveling: Dynamic and static wear leveling algorithms for extended lifespan
  • Bad Block Management: Automatic bad block detection and remapping
  • Garbage Collection: Advanced background garbage collection with TRIM support
  • RAID Engine: Integrated RAID engine within controller for data protection

NAND Flash Memory

  • NAND Type: 3D TLC (Triple-Level Cell) NAND Flash
  • 3D Layers: 64-layer or 96-layer 3D NAND technology (depending on manufacturing date)
  • Manufacturer: YMTC (Yangtze Memory Technologies Corp) or other Chinese NAND manufacturers
  • Memory Density: 512Gb (64GB) per die, typically 8 dies for 512GB capacity
  • Page Size: 16KB typical page size
  • Block Size: 4MB typical block size
  • Plane Configuration: 2 planes per die for improved parallelism
  • P/E Cycles: 1,000-1,500 Program/Erase cycles per cell (typical for consumer TLC NAND)

Memory Configuration & Cache

  • DRAM Configuration: DRAM-less design (no physical DRAM on board)
  • HMB (Host Memory Buffer): Utilizes system RAM as FTL (Flash Translation Layer) cache
  • HMB Allocation: Typically 64MB allocated from system memory (managed by NVMe driver)
  • SLC Cache: Dynamic SLC caching technology (portion of TLC NAND operates as SLC for performance)
  • Cache Strategy: Adaptive caching based on workload and available free space
  • Performance Impact: HMB reduces performance penalty of DRAM-less design compared to traditional DRAM-less SSDs

Endurance & Reliability

  • TBW (Total Bytes Written): 300 Terabytes (300,000 GB written)
  • DWPD (Drive Writes Per Day): 0.16 DWPD (based on 5 years at 512GB per day)
  • MTBF (Mean Time Between Failures): 1,500,000 hours
  • UBER (Unrecoverable Bit Error Rate): <1 sector per 10^17 bits read
  • Data Retention:
    • 1 year at 30°C after endurance specification is reached
    • 3 months at 40°C after endurance specification is reached
  • Power Loss Protection: Basic capacitor array for data protection during sudden power loss (if present)
  • SMART Support: Complete SMART attribute monitoring with predictive failure analysis

Power Consumption

  • Active Power (Read/Write): 3.0-4.0W (maximum during heavy operations)
  • Average Active Power: 2.5-3.0W (typical during mixed workloads)
  • Idle Power: 30-50mW (device idle with background operations)
  • Slumber Power: 10-20mW (low-power state)
  • DevSleep Power: 5-10mW (deep sleep state)
  • Operating Voltage: 3.3V ±5% DC
  • Peak Current: 1.2A maximum (during initialization and heavy writes)
  • Power States: Supports NVMe power states PS0 through PS4
  • Power Management: APST (Autonomous Power State Transition) for automatic power saving

Environmental Specifications

  • Operating Temperature: 0°C to 70°C (32°F to 158°F)
  • Storage Temperature: -40°C to 85°C (-40°F to 185°F)
  • Operating Humidity: 5% to 95% relative humidity (non-condensing)
  • Storage Humidity: 5% to 95% relative humidity (non-condensing)
  • Operating Altitude: Up to 10,000 feet (3,048 meters)
  • Shock Resistance:
    • Operating: 1500G, 0.5ms half-sine wave
    • Non-operating: 1500G, 0.5ms half-sine wave
  • Vibration Resistance:
    • Operating: 20-2000Hz, 20G
    • Non-operating: 20-2000Hz, 20G

Compatibility & System Requirements

  • M.2 Interface: Requires M.2 M-key socket (PCIe NVMe compatible, not SATA M.2)
  • Operating System Support:
    • Windows 10/11 (native NVMe driver support)
    • Linux (kernel 3.3+ with NVMe modules)
    • macOS (on compatible Mac systems with M.2 PCIe slots)
    • Chrome OS (on compatible Chromebooks)
  • BIOS/UEFI Requirements: UEFI firmware with NVMe boot support for use as boot drive
  • System Compatibility:
    • Desktop motherboards with M.2 PCIe Gen 3.0 slots
    • Laptops with M.2 PCIe NVMe slots
    • Mini PCs and NUC devices
    • PlayStation 5 (with heatsink for compliance with PS5 requirements)
    • Xbox Series X/S expansion (with appropriate enclosure)

Features & Technologies

  • NVMe Protocol Features:
    • Multi-queue support (up to 64K I/O queues)
    • MSI-X (Message Signaled Interrupts eXtended) for reduced CPU overhead
    • Scalable I/O performance with parallel processing
    • Low latency command processing
  • Data Protection Features:
    • End-to-end data path protection
    • LDPC error correction with strong correction capability
    • CRC (Cyclic Redundancy Check) for data integrity
    • RAID-like protection within NAND array
  • Performance Optimization:
    • Dynamic thermal throttling to prevent overheating
    • Intelligent SLC caching algorithm
    • Advanced garbage collection with idle-time optimization
    • TRIM command support for maintaining performance
  • Security Features (if supported):
    • AES 256-bit hardware encryption (may vary by model)
    • TCG Opal 2.0 compliance for self-encrypting drive functionality
    • Secure Erase support for data sanitization

Warranty & Support

  • Warranty Period: 3 years from date of purchase
  • Warranty Coverage: Defects in materials and workmanship under normal use
  • Warranty Exclusions: Physical damage, misuse, water damage, data loss
  • Support Type: RMA (Return Merchandise Authorization) service through distributor or retailer
  • Technical Support: Available through Dahua's support channels or authorized distributors
  • Firmware Updates: Available from manufacturer website (if provided)

Package Contents

  • Dahua 512GB NVMe M.2 PCIe SSD
  • Mounting screw (typically included, but may vary by retailer)
  • Limited documentation/warranty information
  • Anti-static packaging
  • Note: No cloning software or migration tools included

Installation Guidelines

  • Physical Installation:
    • Insert SSD into M.2 slot at 30-degree angle
    • Press down gently until seated properly
    • Secure with provided mounting screw
    • Ensure proper key alignment (M-key matches M.2 slot)
  • Software Setup:
    • Initialize drive in Disk Management (Windows) or Disk Utility (macOS)
    • Format with appropriate file system (NTFS for Windows, APFS/HFS+ for macOS, ext4 for Linux)
    • Enable TRIM for optimal long-term performance
  • Boot Drive Configuration:
    • Enable NVMe boot support in BIOS/UEFI settings
    • Set as primary boot device if installing OS
    • Install appropriate NVMe drivers if required by older operating systems

Performance Comparison

  • Compared to SATA III SSD: 4-5x faster sequential read/write speeds
  • Compared to 2.5" HDD: 20-25x faster access times, 8-10x faster sequential transfers
  • Compared to PCIe 4.0 NVMe SSD: Approximately 50-60% of sequential speed, similar random performance for many workloads
  • Real-World Performance:
    • Windows 10/11 boot time: 8-12 seconds
    • Application loading: 2-4x faster than SATA SSDs for large applications
    • Game level loading: 30-50% faster than SATA SSDs
    • File transfers: Excellent for files under 40GB (within SLC cache), moderate for larger files

Use Case Recommendations

  • Ideal Applications:
    • Primary boot drive for Windows, Linux, or macOS systems
    • Gaming drive for faster game loading and level transitions
    • Content creation scratch disk for photo editing and light video work
    • Office productivity systems requiring fast application loading
    • Secondary storage in high-performance workstations
    • PS5 storage expansion (with appropriate heatsink)
  • Less Suitable For:
    • High-end video editing with 4K/8K raw footage (due to sustained write limitations)
    • Database servers with heavy random write workloads
    • Write-intensive server applications requiring high endurance
    • Extreme overclocking systems without proper cooling
  • Capacity Considerations: 512GB provides room for OS, applications, and moderate game/library storage

Manufacturer Information

  • Company: Dahua Technology Co., Ltd.
  • Headquarters: Hangzhou, Zhejiang, China
  • Founded: 2001
  • Primary Business: Video surveillance products and solutions
  • Storage Division: Diversified into SSD manufacturing as complementary business
  • Quality Standards: ISO 9001 quality management system certified
  • Market Position: Value-oriented storage solutions in competitive market

Important Considerations

  • Actual Usable Capacity: Approximately 476GB after formatting and over-provisioning
  • Performance Consistency: Write speeds may drop to 400-600 MB/s after SLC cache is exhausted during large file transfers
  • Thermal Management: May benefit from motherboard heatsink or aftermarket thermal solution during sustained workloads
  • Endurance Planning: 300 TBW equals approximately 164GB written per day for 5 years; suitable for most consumer workloads
  • Compatibility Verification: Confirm M.2 slot supports PCIe NVMe (not just SATA) before purchase
  • Backup Strategy: Implement regular backups as with any storage device; SSDs can fail suddenly
  • Firmware Updates: Check for firmware updates periodically for performance improvements and bug fixes
  • Value Assessment: Offers good performance per dollar for budget to mid-range systems requiring NVMe speeds

Technical Specifications

Dahua 512GB NVMe M.2 PCIe SSD

  • Capacity: 512GB (approximately 476GB usable after formatting)
  • Interface: PCIe Gen 3.0 x4 (NVMe 1.3/1.4 protocol)
  • Form Factor: M.2 2280 (22mm width, 80mm length, M-key)
  • Sequential Read Speed: Up to 2,400 MB/s (maximum under ideal conditions)
  • Sequential Write Speed: Up to 1,800 MB/s (maximum under ideal conditions)
  • Random Read IOPS: Up to 180,000 IOPS (4KB QD32)
  • Random Write IOPS: Up to 200,000 IOPS (4KB QD32)
  • Controller: Realtek RTS5763DL or Maxio MAP1202 mainstream controller
  • NAND Type: 3D TLC (Triple-Level Cell) NAND Flash memory
  • DRAM Configuration: DRAM-less design with HMB (Host Memory Buffer) support
  • Endurance: 300 TBW (Terabytes Written) total endurance rating
  • Warranty: 3-year limited warranty from date of purchase
  • Operating Temperature: 0°C to 70°C (32°F to 158°F)

Shipping & Returns Information

Shipping

  • Free shipping within Mombasa
  • Standard shipping: 2-5 business days
  • Express shipping available at checkout
  • Tracking number provided for all orders

Returns

  • 30-day return policy
  • Items must be in original condition
  • Free return shipping for defective items
  • Refund processed within 5-7 business days

Dahua 512GB NVMe M.2 PCIe SSD

Storage

Product Specs Summary

Dahua 512GB NVMe M.2 PCIe SSD

  • Capacity: 512GB (approximately 476GB usable after formatting)
  • Interface: PCIe Gen 3.0 x4 (NVMe 1.3/1.4 protocol)
  • Form Factor: M.2 2280 (22mm width, 80mm length, M-key)
  • Sequential Read Speed: Up to 2,400 MB/s (maximum under ideal conditions)
  • Sequential Write Speed: Up to 1,800 MB/s (maximum under ideal conditions)
  • Random Read IOPS: Up to 180,000 IOPS (4KB QD32)
  • Random Write IOPS: Up to 200,000 IOPS (4KB QD32)
  • Controller: Realtek RTS5763DL or Maxio MAP1202 mainstream controller
  • NAND Type: 3D TLC (Triple-Level Cell) NAND Flash memory
  • DRAM Configuration: DRAM-less design with HMB (Host Memory Buffer) support
  • Endurance: 300 TBW (Terabytes Written) total endurance rating
  • Warranty: 3-year limited warranty from date of purchase
  • Operating Temperature: 0°C to 70°C (32°F to 158°F)
KShs 5,499.00
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